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Jemplate Platemaking Process

Processes Operations Required Times Remarks
Back exposure Cut the plate into required size and expose to suitable UV light source from back (basefilm) side. To obtain 1.2mm relief with a 3.00mm thick plate and with a normal exposure unit. 1.5 minutes 1. Both bank and main exposures can be given simultaneously according to type of exposure unit. 2. Use an exposure unit equipped with an integrated actinometer.
Main Exposure Remove protection film and vacuum contact negative film emulsion side down and expose to suitable UV light source. 8~13 minutes
Washout Mount the exposed plate bv double sided tape on to the plate holder of wash out unit. 3~6 minutes 1. Adjust brush pressure according to the plate thickness. 2. Always keep washout solution at recommended equipment level.
Drying Dry the plate in a suitable plate dyer at the required temperature of 50~55 ° c. 60~90 minutes Use a dryer equipped with a hot air blower and appropriate exhaust extraction.
Surface Treatment and Post Exposure Eliminates tack from plate surface for improved ink coverage. Expose the plate again to harden remaining polymer. Surface treatment: approx 5 minutes Post exposure: 6~10 minutes 1. Vacuum contact unnecessary for post exposure treatment. 2. Both surface and post exposure treatments can be carried out at the same time in asuitable equipment.

Product Handling Recommendations

Negative films to be used

The density of 3.5 or higher for the black part of the film is recommended.